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Do you need specialty materials for your high-speed designs? Maybe not. Improvements in resins mean designers of high-speed boards can sometimes use traditional laminate systems. Learn more in this issue.
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2019 IPC APEX EXPO Call for Posters
December 11, 2018 | IPCEstimated reading time: Less than a minute
Gain significant visibility for you and your company on your research and knowledge by creating a technical poster at one of the industry's premier conferences on electronics manufacturing. Thousands of individuals will attend IPC APEX EXPO, ensuring that your work is seen by key engineers, managers and executives from all segments of the electronic interconnect industry worldwide. Posters will be displayed throughout the event. Poster presentations are scheduled for Wednesday, January 30, 2019 offering additional visibility.
Poster Topics
Submissions are sought in all areas of the electronics industry, including design, materials, assembly, processes and equipment.
Requirements for Submission
Provide an abstract of up to 300 words that summarizes technical and previously unpublished work covering case histories, research and discoveries.
Poster Presenter Benefits
Poster presenters are entitled to a free One-Day Conference Pass for Wednesday, January 30, 2019.
Deadline for Abstracts: Monday, December 17, 2018
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