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LQDX Divests Aluminum Soldering Business - Mina™ - to Taiyo America Inc.

05/02/2024 | PRNewswire
LQDX, formerly known as Averatek Corp., developer of high-performance materials for advanced semiconductor manufacturing, today announced that it has divested its aluminum soldering business – known as MinaTM – to Taiyo America Inc., a global market leader in advanced electronic materials.

TTM Technologies Reports First Quarter 2024 Results

05/02/2024 | TTM Technologies
TTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency components and RF microwave/microelectronic assemblies, quick-turn and technologically advanced printed circuit boards , reported results for the first quarter 2024, which ended on April 1, 2024. 

Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024

05/01/2024 | SEMI
Worldwide silicon wafer shipments decreased 5.4% quarter-over-quarter to 2,834 million square inches in the first quarter of 2024, a 13.2% drop from the 3,265 million square inches recorded during the same quarter last year, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry.

IPC's Vision for Empowering PCB Design Engineers

04/30/2024 | Robert Erickson, IPC
As architects of innovation, printed circuit board designers are tasked with translating increasingly complex concepts into tangible designs that power our modern world. IPC provides the necessary community, standards framework, and education to prepare these pioneers as they explore the boundaries of what’s possible, equipping engineers with the knowledge, skills, and resources required to thrive in an increasingly dynamic field.

Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications

04/30/2024 | Indium Corporation
Indium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
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