-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Atotech to Participate in Productronica and SEMICON Europa 2019
November 1, 2019 | AtotechEstimated reading time: 1 minute
Atotech will be exhibiting at Productronica and SEMICON Europa 2019. Visitors to these events are welcome to join the Atotech technical conference talks and meet the product and technology experts directly at the conference or at any time at the company’s booth no. 455 at productronica in Hall B3.
Atotech’s key highlights at the booth include:
- ViaKing® – Atotech’s new enhanced graphite direct metallization for flex and advanced base materials.
- Printoganth® P2 – Universal hor. electroless copper process for advanced base materials including 5G.
- InPro® MVF2 – Advanced BMV filling in VCP equipment for HDI production.
- InPro® RA – Advanced BMV filling electrolyte for bright copper deposition for flex/flex PCBs.
- OS-Tech® – An environmentally friendly, high functioning simple process.
- PallaBond® – Direct pure EPAG for ultra fine L/S application.
- CupraEtch® SR8000 – Dryfilm and soldermask pretreatment with advanced adhesion performance.
- BondFilm® EX – Bonding enhancement solution for low signal loss with high frequency applications.
- vPlate® – Vertical continuous copper plating technology of choice for advanced HDI and IC substrate.
- MultiPlate for FOPLP – Next generation plating system and Innolyte® process family for panel level packaging.
- Xenolyte® Ni TR – High temperature resistant Ni for RDL and pad metallization.
- Spherolyte® SnAg – High speed SnAg for lead free, pure and uniform solder bump plating
- Argalin ® XL – High performance inorganic and Cr(VI)-free silver anti-tarnish
- Stannopure PF – High speed Tin process for lead frames and connectors with perfect coverage
Suggested Items
Indium Corporation to Present, Exhibit at EPP InnovationsFORUM
03/28/2024 | Indium CorporationIndium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
03/28/2024 | Rehm Thermal SystemsCurrent developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.
Indium Corporation, Industry Partners to Showcase Products “Live@APEX”
03/26/2024 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Apr. 9‒11 in Anaheim, Calif., U.S.
ITW EAE Wins New Product Introduction Award for Electrovert® Wave Soldering Machine Deep Wave
03/26/2024 | ITW EAEITW EAE is proud to announce that it has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines. This new, innovative system provides the ability to pump up to a 20 mm wave height.
Mek's Next-Gen AOI Technology Takes Center Stage at IPC APEX EXPO 2024
03/19/2024 | MEKMek is excited to announce its presence at IPC APEX EXPO, North America's largest electronics manufacturing event, in Anaheim, California, from April 6-11, 2024. Attendees are invited to visit Mek at booth #1433 to explore the latest AOI technology offerings.