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Foxconn Signs MOU with Universities in India to Improve Language Skills

01/22/2024 | Foxconn
Hon Hai Technology Group (Foxconn) announced it signed a Mandarin-language education project MOU with four tertiary institutions in India aimed to deepen industry-academia ties and incubate future talent.

Intense Competition in DDIC Supply Market Expected in 2024, with Continued Pressure on Prices

12/25/2023 | TrendForce
TrendForce’s latest investigations forecast an exciting yet challenging year for the DDIC market in 2024. With prices in 2023 mostly stabilizing or showing a slight decline, the upcoming year is poised for a transformative shift.

Keysight Unites Europe and Asia for 6G Research

11/13/2023 | Keysight Technologies
Through the project leadership of Keysight Technologies, the Horizon Europe-funded 6G-SANDBOX project signed a memorandum of understanding (MoU) with the Industrial Technology Research Institute (ITRI) to foster collaboration between Europe and Taiwanese companies for 6G research. 

Second Half Utilization Rate for 8-inch Production Capacity Expected to Drop to 50-60%; Chilly Demand Prospects Until 1Q24

10/06/2023 | TrendForce
TrendForce research indicates that in 1H23, the utilization rate of 8-inch production capacity primarily benefited from sporadic inventory restocking orders for Driver ICs in the second quarter.

TPCA: Favorable Exchange Rate Sees Better Than Expected Q3 Growth for the Taiwan PCB Industry

02/15/2023 | TPCA
Taiwan Printed Circuit Board Association (TPCA) announced that the Taiwanese PCB industry on both sides of the strait was worth 249.2 Billion TWD (approx. 8.198 billion USD) in Q3, 2023 and set a new record for Q3 results year-over-year.
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