-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
iNEMI Call for Participation Webinar Dec. 12
December 6, 2019 | iNEMIEstimated reading time: 1 minute
Flip chip electronic packages are commonly used to address today’s high-density interconnect needs. However, the formation of small voids (microvoids) can occur in solder-based flip chip joints during the assembly process and these voids tend to grow after multiple reflows. This can be a concern for certain applications that involve high electrical and thermal flux across the flip chip where void formation can have an impact on electromigration in the joint. The presence of a void can accelerate complete open failure due to electromigration.
This project will study voids in flip chip interconnect to determine their location and volume. It will also seek to understand how voiding in 1st level interconnect affects product reliability and what level of voiding is acceptable while maintaining reliability requirements. The project will have two distinct phases:
- Phase 1: Determine recommended inspection capabilities for micro-voids in 1st level interconnect materials
- Phase 2: Determine the relationship between voids and the electrical and mechanical reliability of the assembly
The project is expected to develop technical guidelines regarding acceptable voiding characteristics for flip chip interconnects that can be shared with industry and relevant standards bodies.
The 1st Level Interconnect Void Characterization Project is led by Lee Kor Oon (Intel) as project leader, with Sze Pei Lim (Indium) and Kiyoshi Ooi (Shinko) as co-leaders. Click here for additional project information.
Call-for-Participation Webinars
If you are interested in this project, please join us for one of our call-for-participation webinars. These webinars are open to industry (iNEMI membership is not required). Participants must register in advance. Click on the links below to register. For additional information, please contact Masahiro Tsuriya (m.tsuriya@inemi.org).
Session 1 (APAC)
Date: December 12, 2019
Time: 10:00 a.m. JST (Japan)
9:00 a.m. CST (China)
8:00 p.m. EST (U.S.) on Dec. 11
5:00 p.m. PST (U.S.) on Dec. 11
Session 2 (Americas and EMEA)
Date: December 12, 2019
Time: 7:00 a.m. EST (U.S.)
1:00 p.m. CET (Europe)
8:00 p.m. CST (China)
9:00 p.m. JST (Japan)
Suggested Items
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation are proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia. on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.