Amphenol Ardent Concepts Releases New Low-Profile Right Angle 16-Channel Multicoax Connector
January 9, 2020 | Amphenol Ardent ConceptsEstimated reading time: 1 minute
Amphenol Ardent Concepts has released a new form factor of its TR Multicoax connector. This new 16-channel right angle variant is designed specifically to alleviate height concerns of our vertical launch connectors in applications that are Z-height limited, including taking signals from underneath the board, escaping signals under a heat sink, or getting cables out under a thermal shroud. This new form factor utilizes the standard 16-channel footprint that Ardent’s Straight Mount TR Multicoax is designed for, allowing designers to exchange launch form factors without any layout change.
“Designers today are facing the increasing challenge of laying out more complex printed circuit boards with added dimensional constraints,” said Nat Stevens, Amphenol Ardent’s Director of Marketing. “By expanding our already wide offering of form-factors, channel counts, and frequency options for our TR Multicoax products, while standardizing on a few footprint symbols, engineers have significantly more project flexibility.”
The dense PCB footprint of the TR Multicoax saves crucial real estate and gets the coaxial cables extremely close to devices, minimizing lossy trace lengths. The interface is compression-mount which avoids waste of costly solder-down components that can’t be recovered, and encourages reuse across programs.
TR Multicoax series connectors are offered in a variety of channel counts and form factors and can support speeds of 70 GHz+ with a roadmap to 110 GHz in the near future. For more information, please contact Amphenol Ardent at info@ardentconcepts.com
Suggested Items
Indium Corporation to Present, Exhibit at EPP InnovationsFORUM
03/28/2024 | Indium CorporationIndium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
03/28/2024 | Rehm Thermal SystemsCurrent developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.
Indium Corporation, Industry Partners to Showcase Products “Live@APEX”
03/26/2024 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Apr. 9‒11 in Anaheim, Calif., U.S.
ITW EAE Wins New Product Introduction Award for Electrovert® Wave Soldering Machine Deep Wave
03/26/2024 | ITW EAEITW EAE is proud to announce that it has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines. This new, innovative system provides the ability to pump up to a 20 mm wave height.
Mek's Next-Gen AOI Technology Takes Center Stage at IPC APEX EXPO 2024
03/19/2024 | MEKMek is excited to announce its presence at IPC APEX EXPO, North America's largest electronics manufacturing event, in Anaheim, California, from April 6-11, 2024. Attendees are invited to visit Mek at booth #1433 to explore the latest AOI technology offerings.