-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
IPC and High Density Package Users Group Strengthen Collaboration with MoU
June 24, 2020 | IPCEstimated reading time: 1 minute
IPC and High Density Package Users Group (HDP), a trade organization representing companies involved in the supply chain of manufacturing products that utilize high-density electronic packages and printed circuit boards, have signed a Memorandum of Understanding (MoU), enabling a strengthened partnership, increased technical collaboration between groups, and providing a mutual path toward emerging and disruptive high density interconnect (HDI) technologies.
“Both IPC and HDP are member-driven organizations,” said Matt Kelly, IPC chief technologist. “Working together, both organizations will focus on next generation HDI technology projects to benefit the electronics manufacturing industry. HDP is very well established with more than 25 years of experience in R&D technology development. Resultant, new HDI learning and solutions will help drive IPC standards development activities as well as training and education programs.”
IPC and HDP have successfully worked together for many years on such electronics industry issues as electrochemical migration, high density ball grid arrays, board thickness on solder joint reliability and members of HDP have presented papers at IPC APEX EXPO on high frequency loss test methods for laminate materials and smooth copper signal integrity.
“A closer working relationship between IPC and HDP will bring significant advantages to both organizations, and as a result, to the industry,” noted Marshall Andrews, executive director of HDP. “Electronics manufacturing technology is moving faster than ever with the introduction of 5G and automotive applications. Close cooperation at all levels of the supply chain will be necessary to address issues and implement the new materials and processes required to keep moving forward. IPC and HDP will help make those changes smooth and reliable.”
Suggested Items
Indium Corporation to Present, Exhibit at EPP InnovationsFORUM
03/28/2024 | Indium CorporationIndium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
03/28/2024 | Rehm Thermal SystemsCurrent developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.
Indium Corporation, Industry Partners to Showcase Products “Live@APEX”
03/26/2024 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Apr. 9‒11 in Anaheim, Calif., U.S.
ITW EAE Wins New Product Introduction Award for Electrovert® Wave Soldering Machine Deep Wave
03/26/2024 | ITW EAEITW EAE is proud to announce that it has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines. This new, innovative system provides the ability to pump up to a 20 mm wave height.
Mek's Next-Gen AOI Technology Takes Center Stage at IPC APEX EXPO 2024
03/19/2024 | MEKMek is excited to announce its presence at IPC APEX EXPO, North America's largest electronics manufacturing event, in Anaheim, California, from April 6-11, 2024. Attendees are invited to visit Mek at booth #1433 to explore the latest AOI technology offerings.