Swissbit Features Miniaturized Highly Reliable PCIe M.2 BGA SSD for Ultra-Small Industrial Applications
August 6, 2020 | SwissbitEstimated reading time: 2 minutes
Swissbit launches EN-20, a new single chip solution which offers high speed PCIe SSD performance in a 3.2cm² BGA package. The device acts as a true industrial grade SSD with up to 480GB capacity and 4 lane PCIe 3.1 / NVMe 1.3 specification. It enables high performance and high reliability for small size embedded systems, factory automation, routers and switches, Internet of Things (IoT), cloud computing, and medical systems.
The EN-20 product series features industrial grade 3D NAND supporting an ambient temperature range from -40°C to 85°C. The managed device combines high grade NAND Flash chips, a sophisticated PCIe controller and firmware that supports demanding applications. The PCIe 4 lane interface with backwards compatibility to single or dual lane system designs operates according to the latest PCIe 3.1 specification and offers high bandwidth up to 1600 MB/s for sequential read and 770 MB/s for sequential write. Random performance surpasses 145,000 / 130,000 IOPS for read and write and nearly doubles the bandwidth of SATA SSDs.
The single chip has a dimension of 16 x 20mm and a 0.8mm pitch compatible with standard PCB routing guidelines. For low power consumption without sacrificing performance, EN-20 substitutes a local DRAM cache by using the HMB (host memory buffer) feature, which uses system DRAM memory to maintain the flash translation table. Intelligent thermal management protects the long-term stability of the controller and maintains a continuous bandwidth even at highest specified temperatures. Other reliability and security features are End-to-End Data Path Protection (ETEP), AES 256 encryption, LDPC error correction with full page fail recovery and a protection against sudden power loss. Data care management adds extra protection of the stored data at high operating temperatures.
The NVMe protocol has been designed to efficiently use the bandwidth with a native nonvolatile memory command set resulting in ultra-low latency.
EN-20 offers a high performance, high reliability, cost efficient, true industrial SSD in a single BGA chip with up to 1 DWPD endurance. For even higher endurance requirements, EN-26 in full pSLC mode provides a 10-fold endurance.
EN-20 has already been successfully qualified by key industrial customers and is currently available with densities from 15 GB to 240 GB in the TLC version and with 5 GB to 80GB for EN-26. An extension to 480 / 160 GB will follow later this year.
The small size and integrated metal heat spreader allows the use of EN-20 not just as a single BGA device but also on a variety of m.2 module form factors from a tiny 2230 length to the standard 2280 variant. EN-20 also powers the soon to be introduced Swissbit G-20 CFexpress™ cards with the same extensive feature set.
Suggested Items
Real Time with... IPC APEX EXPO 2024: Industrial Quality Solutions from Zeiss
04/23/2024 | Real Time with...IPC APEX EXPOEditor Nolan Johnson and Herminso Gomez of Zeiss Group discuss the company's industrial quality solutions, with a focus on X-ray technology. Zeiss provides a range of microscopy options and Herminso highlights the advantages of X-ray technology for aerospace, medical, and consumer electronics sectors.
Altair Acquires Cambridge Semantics, Powering Next-Generation Enterprise Data Fabrics and Generative AI
04/22/2024 | AltairAltair a global leader in computational intelligence, acquired Cambridge Semantics, a modern data fabric provider and creator of one of the industry’s leading analytical graph databases.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
04/19/2024 | Marcy LaRont, PCB007 MagazineFor my must-read picks of the week, I’m highlighting Parker Capers, a young professional seeking employment, solid counsel from Dan Beaulieu on what your post-show plan should look like, more information and insight on “chiplets” and the need for secure data transfer standards from columnist Preeya Kuray, as well as Matt Stevenson’s design for reality wisdom. It’s a reminder to download one of our newest books (there are several) you don't want to miss if you are an assembler.
D Coupon Testing and Data Insights With GreenSource Fabrication
04/17/2024 | Marcy LaRont, PCB007 MagazineMarcy LaRont spoke with Steve Karas of GreenSource Fabrication at the SMTA UHDI conference in March. He presented a case study that GreenSource undertook with a customer on critical via reliability with advanced materials and used the experience to highlight the importance and effectiveness of D coupon testing. He also discussed GreenSource’s approach to data aggregation and a new system they developed to use collected data effectively.
Real Time with... IPC APEX EXPO 2024: Innovations in Thermal, Warpage, and Strain Metrology
04/17/2024 | Real Time with...IPC APEX EXPOEditor Nolan Johnson talks with Neil Hubble, president of Akrometrix, about the company's leadership in thermal, warpage, and strain metrology. Neil details how Akrometrix is committed to addressing customer challenges through technological evolution, innovative solutions, and a focus on data processing. A tabletop unit for thermal warpage testing is showcased at IPC APEX EXPO this year.