-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
MacDermid Alpha Releases Systek ETS 1200 Pattern Plating Metallization for Embedded Trace Substrates
August 6, 2020 | MacDermid Alpha Electronics SolutionsEstimated reading time: 2 minutes
MacDermid Alpha Electronics Solutions, a global leader in specialty materials for electronics, announces the release of Systek ETS 1200, the latest addition to the Systek family of IC Substrate manufacturing solutions.
Systek ETS 1200 is an advanced DC acid copper pattern plating process specifically formulated to plate fine lines and pads in embedded trace substrates. With the dimensions utilized in panel-level packaging growing ever finer and more electrically demanding, embedded trace technology provides the tight tolerances required to route the circuitry on the organic substrate.
Systek ETS 1200 excels at plating the difficult to achieve trace profile tolerances and coplanarity requirements of the die interface outerlayer of the IC substrate. The process is production-proven with dimensions as fine as 7/7 µm lines and spaces and has capability to accommodate further density increases should substrate designers require them. Systek ETS 1200 plates traces with sharp cornered square trace profiles that are encased in build-up film for superior electrical isolation with very low impedance. Copper deposits plated with the Systek ETS 1200 bath exhibit very low internal stress and exceed IPC Class III standards for tensile strength and elongation, creating a durable interconnection with no warpage. Chemical process control is achieved with simple CVS analysis of a 3-component system, ensuring quality and ease of use.
MacDermid Enthone’s Systek UVF 100 process for 2 in 1 RDL plating can be combined with the Systek ETS 1200 embedded trace technology, to create extremely high-density coreless buildup layers for panel-level packaging.
“Systek ETS 1200 has the ability to create some of the tightest circuit routing we have ever seen on organic substrates. We are excited to offer this embedded trace plating technology as part of our broad range of metallization solutions for panel-level packaging. Our customers are even more excited to see how it can impact their bottom-line profitability and available design capabilities.” – Rich Bellemare, Director of Electrolytic Metallization, Circuitry Solutions.
For more information on Systek ETS 1200, please visit MacDermidAlpha.com
About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Kester, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time.
Suggested Items
IMI Taps New Opportunities to Sustain Grit in China
03/28/2024 | IMIIntegrated Micro-Electronics, Inc. (IMI), Joey S. Bantatua, IMI China’s head of operations and general manager was recently interviewed by Asia Electronics Industry (AEI) magazine where he talked about the prospects of the country both as a market and a production hub.
Kimball Electronics Publishes Annual Sustainability Disclosures with its 2023 Guiding Principles Report
03/28/2024 | BUSINESS WIREKimball Electronics, Inc. published its annual sustainability disclosures in its 2023 Guiding Principles Report, themed “How We Are Winning Together The Kimball Way.”
iNEMI Webinar: Humidity Robustness and Insulation Coordination for e-Mobility
03/27/2024 | iNEMIThis webinar is a follow-up to the recent Seminar on Humidity Robustness and Insulation Coordination for e-Mobility, organized by iNEMI and ZESTRON Europe and supported by the ECPE.
Electronics Industry Sentiment Rises in March
03/27/2024 | IPCIPC releases March 2024 Global Sentiment of the Electronics Supply Chain Report
Mycronic to Showcase More Versatile, High-productivity Assembly Solutions at IPC APEX EXPO 2024
03/27/2024 | MycronicMycronic, the leading Sweden-based electronics assembly solutions provider, will continue to respond to growing customer demand for high-flexibility, high-productivity solutions for zero-defect PCB assembly at IPC APEX EXPO 2024 in Anaheim, CA on April 9 - 11.