Altium Talks 3D Flex Packaging Design


Reading time ( words)

Altium Product Manager Ben Jordan and Editor Kelly Dack sat down at IPC APEX EXPO to discuss Altium’s new tools for designing flex and rigid-flex circuits. The new software allows users to model the design in 3D, eliminating the need for rigid-flex designers to create “paper dolls” for each design.

To watch this interview, click here.

Share

Print


Suggested Items

Max Seeley: Some Designers Hesitant to Adopt New Tech

02/20/2020 | Andy Shaughnessy, Design007 Magazine
I spoke with Max Seeley of 3M about a design class he presented at AltiumLive in Frankfurt, Germany. We also discussed autorouting and the continuing advances in EDA tools, as well as the schism between users who embrace new technology and those who still prefer to layout their boards the old-fashioned way. Which camp do you belong to?

Joe Clark Says DownStream Is Ready for More Growth in 2020

02/20/2020 | Kelly Dack, CID+, EPTAC
Joe Clark, co-founder of DownStream Technologies, gives Kelly Dack an overview of the company and their innovative product line, which serves to smooth the bumps that can occur between source design output and manufacturing line input. As Joe explains, 2019 was a great year for the company, and he expects that trend to hold through 2020.

IPC Designers Council Has a New Name: IPC Design

02/11/2020 | Andy Shaughnessy, Design007 Magazine
Yes, you read that right. The IPC Designers Council is now known as IPC Design. Many of you have heard secondhand stories about what this change will entail, so I asked IPC to shed some light on this subject. I recently spoke with IPC’s Teresa Rowe and Patrick Crawford about what’s changing, what’s not, and IPC’s plans to provide improved infrastructure for PCB design content and curriculum.



Copyright © 2020 I-Connect007. All rights reserved.