Altium Talks 3D Flex Packaging Design


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Altium Product Manager Ben Jordan and Editor Kelly Dack sat down at IPC APEX EXPO to discuss Altium’s new tools for designing flex and rigid-flex circuits. The new software allows users to model the design in 3D, eliminating the need for rigid-flex designers to create “paper dolls” for each design.

To watch this interview, click here.

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