Altium Talks 3D Flex Packaging Design


Reading time ( words)

Altium Product Manager Ben Jordan and Editor Kelly Dack sat down at IPC APEX EXPO to discuss Altium’s new tools for designing flex and rigid-flex circuits. The new software allows users to model the design in 3D, eliminating the need for rigid-flex designers to create “paper dolls” for each design.

To watch this interview, click here.

Share

Print


Suggested Items

Brad Griffin Discusses Cadence’s New Transient Solver Technology

10/26/2020 | Andy Shaughnessy, Design007 Magazine
Andy Shaughnessy speaks with Brad Griffin, product marketing director for Cadence Design Systems, about their new Clarity 3D Transient Solver, which is designed for system-level EMI simulation. Brad explains how the new solver, based on the company’s matrix technology, can yield results 10 times faster than existing solvers when simulating IC packages, PCBs, and SoIC designs.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/23/2020 | Andy Shaughnessy, Design007 Magazine
After a crazy year like this, we shouldn’t be surprised that this trade show season is unlike any other. Here’s one of the many “silver linings” of 2020: We actually dodged a bullet earlier this year when COVID-19 hit after most of our industry’s big events had taken place. In this week’s top five, we have an assortment of trade show and conference news items, plus a few examples of technological trends and innovation.

Real Time with… AltiumLive Europe: 21st-Century Tools Keynote

10/22/2020 | Pete Starkey, I-Connect007
Good morning, Europe!” Altium VP of Marketing Lawrence Romine said as he introduced the European edition of Altium’s PCB design conference—established as an annual must-attend event, but for 2020 presented in a virtual format. Pete Starkey brings you the details from AltiumLive Europe's opening keynote on 21st-century tools and what's coming in 2021.



Copyright © 2020 I-Connect007. All rights reserved.