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Alpha, the world leader in the production of electronic soldering materials, introduced its latest product offering for Die Attach applications, including a world first for Sintering at the PCIM show in Nuremberg, Germany, on the 19th-21st May.
Alpha’s new ALPHA Argomax 9000 Preforms are a world first for the Power Semiconductor Industry. These innovative preforms deliver superior thermal conductivity, ultra high reliability and excellent electrical conductivity. They have shown excellent performance in large area attachment and can help to simplify the manufacturing process.
Alpha’s Global Product Manager for Sintered Materials, Julien Joguet attended PCIM for Alpha, “This year we launched one of our most innovative products at PCIM, the ALPHA® Argomax® 9000 preforms. Up until now ALPHA® Argomax® has only been available in both paste and film formats, but now we are the first to introduce a sintering product in a preform format to widen our product portfolio and extend the superior capabilities of Argomax®.”
Argomax® 9000 preforms can be used in a range of applications from power modules to Automotive applications, in areas in which thermal and electrical conductivity and joint strength is crucial. The preforms are available in tape and reel format and waffle pack for standard pick and place equipments.
In addition, Alpha showcased its broad range of products for Die Attach applications including the full Argomax® range and ALPHA® Atrox™D800HT Series Die Attach Paste which is specially designed for packages requiring rapid heat dissipation. The paste delivers high reliability and can be used for a wide range of die attach applications including Std IC, PMIC, Analog, RF and Power Discrete Packages.
Alpha was also joined by representatives for Besi and Boschman on the stand which allowed for practical demonstrations of Alpha products on equipment such as pick and place machines.
Alpha, a business unit of Alent plc, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Americas, Europe and Asia Pacific regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™, Maxrel™, and Fortibond™ brands. For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process.
Alpha also offers product technologies for the Photovoltaic segment, including its unique pre-fluxed ALPHA® PV Ready Ribbon®, high performance standard ribbon, bus bar, solder wire and flux. Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications. Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, visit www.alpha.alent.com.