-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Metcal's Paul Wood to Present at the BEST Tech Symposium
September 2, 2015 | MetcalEstimated reading time: 1 minute
Paul Wood of Metcal is speaking at the BEST Tech Symposium on Small Package Challenges, scheduled to take place Thursday, Oct. 1, 2015 at Pinstripes - South Barrington in South Barrington, Illinois. Wood will present “Hand Soldering Techniques for Small Packages.”
“I am delighted to speak about hand soldering techniques for small packages at the Best Tech Symposium,” said Wood, Metcal’s advanced product applications manager. “The list of topics and speakers at the symposium will address a number of assembly challenges and should be a great benefit to anyone facing these issues.”
There are numerous challenges for the rework technician in trying to rework very small outline packages such as 0201 and 01005s, and ultra-fine pitch small outline parts such as SOICs with a 0.3 mm pitch. Modern hand tools and techniques are required to rework these devices. The hand tools need to be very small, light, ESD-safe tools with low air flow and closed-loop controls for airflow and heat. This talk will focus on how such a tool can be used to make the rework of these small packages simpler and faster. In addition, various “how to” techniques through photos and application videos will be highlighted.
Wood is an industry expert in the BGA/CSP/array package rework arena. With 33 years of service at OK International, Inc., and 42 years of experience in the electronics industry, Mr. Wood has used his global experience in rework to keep electronics assembly manufacturers on the leading edge of technology.
In addition to Wood, the BEST Tech Symposium will feature a number of other speakers, all discussing different aspects of assembly challenges of small packages. The symposium promises to increase attendees’ understanding of the challenges involved in small footprint device assembly.
About Metcal
Since 1982, Metcal has been a recognized worldwide leader in the electronics assembly marketplace. As part of OK International, Metcal’s industry-leading position addressing advanced technology in conduction soldering and rework/repair, has and will continue to broaden to a full electronics bench tool single-source solution. Metcal product lines currently include: hand soldering and desoldering, convection rework products, fume extraction and fluid dispensing tools.
Suggested Items
Altair SimSolid Transforms Simulation for Electronics Industry
03/29/2024 | AltairAltair, a global leader in computational intelligence, announced the upcoming release of Altair SimSolid for electronics, bringing game-changing fast, easy, and precise multi-physics scenario exploration for electronics, from chips, PCBs, and ICs to full system design.
IMI Taps New Opportunities to Sustain Grit in China
03/28/2024 | IMIIntegrated Micro-Electronics, Inc. (IMI), Joey S. Bantatua, IMI China’s head of operations and general manager was recently interviewed by Asia Electronics Industry (AEI) magazine where he talked about the prospects of the country both as a market and a production hub.
Kimball Electronics Publishes Annual Sustainability Disclosures with its 2023 Guiding Principles Report
03/28/2024 | BUSINESS WIREKimball Electronics, Inc. published its annual sustainability disclosures in its 2023 Guiding Principles Report, themed “How We Are Winning Together The Kimball Way.”
iNEMI Webinar: Humidity Robustness and Insulation Coordination for e-Mobility
03/27/2024 | iNEMIThis webinar is a follow-up to the recent Seminar on Humidity Robustness and Insulation Coordination for e-Mobility, organized by iNEMI and ZESTRON Europe and supported by the ECPE.
Electronics Industry Sentiment Rises in March
03/27/2024 | IPCIPC releases March 2024 Global Sentiment of the Electronics Supply Chain Report