Technica’s Annual Tech Forum a Success

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Technica USA hosted its Annual Technology Forum Event July 22–23 in San Jose, California. The event was co-sponsored by ASM Assembly Systems, with active participation from Koh Young Technology and Rehm Thermal Systems.

Just as last year, the technical presentations were conveyed at the conveniently located Club Auto Sport Event Center. The morning session began with a presentation by Jeff Schake, senior advanced technology specialist at ASM-DEK. Schake's many years of experience in managing printing focused process investigations for DEK enabled him to focus his presentation, titled "Blueprint to High Yield Stencil Printing," on best practices of printing process design and execution. He presented examples of print process defects and corresponding cause and effects that were later demonstrated during the afternoon session.

Koh Young's Dr. Eric Jeon, director of R&D Center, and David Suh, technical support and applications engineer, co-presented on the best method to improve production yield. Their presentation focused on the value of using the data retrieved from SPI to improve process yields, and provided many examples on how 3D solder paste inspection could immediately provide engineers with information that could effectively address issues that arise in printing. The presentation also emphasized the value of creating an environment to utilize the data from the 3D SPI and 3D AOI to make corrections in the process in real time.

In his presentation, "The Main Reasons for SMT Placement Defects and How to Prevent Them," Tom Foley, quality manager for ASM-Siplace, provided a perspective that was unique when thinking about placement defects. He provided an overview of how the process of reducing defect begins from when the component materials arrive at the facility. Foley presented the latest in production methods including advancements in software and hardware designed to error-proof the SMT placement process.

Helmut Ottl, head of product management at Rehm Thermal Systems, delivered the last presentation titled "Today's Challenge – Complex Boards with 03015 Parts Up to Large Components". Ottl's presentation was based on the results founded through a consortium effort established in Germany where he and the team at Rehm Thermal System were intimate in the study. ASM-Siplace and a few other companies were also involved in this effort. Ottl went on to provide the results of this study in detail.

After the hosted lunch at Club Auto Sport, the afternoon portion of the agenda took place at Technica's Demonstration and Training Center nearby the event center. It was here that each of the companies involved in the morning sessions were able to demonstrate the cause and effect of process defects, how to detect them, and how to resolve them by utilizing technologies that are available today.

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Editor's Note: This article originally appeared in the September 2015 issue of SMT Magazine.



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