Last Call for IPC Flexible Circuits-HDI Forum Registration

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The IPC Flexible Circuits-HDI Forum, scheduled for October 28-30, 2015, in Minneapolis, Minnesota, will provide attendees the opportunity to learn through various tutorials, speaker presentations, and keynote speeches.

Focusing on military, aerospace, medical, and automotive electronics industries, the event will feature senior technologists from companies including TTM Technologies, DuPont, Battelle, Multek-Flextronics, Insulectro, Firan Technology Group Corporation, Orbotech, eSurface, Science Applications International Corp. (SAIC), RBP Chemical Technology, and Intrinsiq Materials.

To register for the event, click here.

06/11/2020 | Pete Starkey, I-Connect007

In normal circumstances, it would have been the time of year for the EIPC Summer Conference, and Walt Custer would have opened the proceedings with his business outlook for the global electronics industry. However, circumstances were far from normal. Pete Starkey discusses some of the takeaways from Custer's global business outlook webinar, organized by EIPC.

04/22/2020 | Pete Starkey, I-Connect007

Against a background of COVID-19 uncertainty and unprecedented challenges, but recognizing the vital importance of continuing to educate engineers and share the knowledge and skills required to manufacture boards and assemblies of the highest yields and reliability, the IPC Europe team hosted a technical webinar for the European electronics industry, featuring the expertise of two of I-Connect007’s regular columnists: Mike Carano and Jan Pedersen. Pete Starkey provides an overview.

03/16/2020 | Patty Goldman, I-Connect007

Patty Goldman speaks with Dr. Bhanu Sood of NASA, Dieter Bergman IPC Fellowship Award recipient, about his extensive involvement with IPC on many committees developing standards to his work teaching professional development courses and mentoring young engineers.