-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
IPC Standards Committee Reports – Component Traceability, Base Materials, Fabrication Processes, Assembly and Joining
December 1, 2015 | IPCEstimated reading time: 5 minutes
Component Traceability
The 2-19a Critical Components Traceability Task Group held its first face-to-face meeting to continue development of the working draft IPC-1782, Standard for Traceability of Critical Items Based on Risk. This standard will establish minimum requirements for traceability of items throughout the entire supply chain, with particular initial emphasis on component traceability through the manufacturing and assembly processes. This standard will also be used as a base document for a possible series of standards for traceability of other parts through the supply chain.
Base Materials
The 3-11 Laminate/Prepreg Materials Subcommittee successfully examined and modified Amendment 2 to the IPC-4101D-WAM1, Specification for Base Materials for Rigid and Multilayer Printed Boards. Amendment 2 is proposed by the European Space Agency to concentrate on laminate and prepreg of substantially lower contaminant level. The proposed Amendment 2 will be composed of a newly constructed Appendix A which will be routed as a Final Draft for comment to all interested parties.
The 3-11f UL/CSA Task Group reviewed the 22 items for STP Ballot in UL 746E. This Ballot will close on November 9, 2015.
The 3-11g Corrosion of Metal Finishes Task Group discussed work that IBM (Dr. P. J. Singh) has done with Flowers of Sulfur testing.
The 3-12a Metallic Foil Task Group addressed the non-contact surface roughness test (proposed TM 2.2.22). Re-analysis of the round robin test data showed that the Gauge R & R was sufficient such that the proposed test method would be sent out as a Final draft for comment, once the test method verbiage was ‘cleaned up’.
The 3-12d Woven Glass Reinforcement Task Group reviewed spread glass data generated by JPS using weave style 1280 E-glass. Three new weave styles were submitted for addition into the IPC-4412B Appendices II. – These will be routed as a Final Draft of an Amendment 2. Finally, a minor change was noted to the group as to an IPC position statement concerning a European REACH treatment of boron trioxide as a Substance of Very High Concern.
Fabrication Processes
The 4-14 Plating Processes Subcommittee reviewed the latest draft of IPC-4552A, Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards. The group also reviewed the about-to-be released Amendment 1 to IPC-4556, Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards.
Assembly and Joining
The 5-11c Electronic Assembly Adhesives Task Group recently approved for publication IPC-HDBK-4691, Handbook on Adhesive Bonding of Electronic Assembly Operations. The group will celebrate the publication when it meets at APEX/EXPO in Las Vegas. The task group will also begin review of orphaned Test Method 2.4.51 for dispersion of glass microbeads in self-shimming thermally conductive adhesives. The group will investigate if a similar industry test exists and also if glass microbeads in adhesives are still used on a regular basis.
The 5-20 Product Assurance Committee reviewed the status of the projects in its scope and started planning for the meetings to be held at APEX 2016.
The 5-21f Ball Grid Array Task Group has begun work on the D revision of IPC-7095, Design and Assembly Process Implementation for BGAs. Items to be addressed in this revision include harmonization with the latest revisions of IPC-A-610 and J-STD-001, updating the Reliability section, supply chain issues and oxidation levels of ball surfaces.
The 5-21g Flip Chip Mounting Task Group continued its work on revision A to IPC-7094, Design and Assembly Process Implementation for Flip Chip and Die Size Components. The group is focusing on glob top, dam and fill, and frame and fill adhesives as well as reviewing submitted content and existing/new figures for the standard.
The 5-21h Bottom Termination Components Task Group broke ground on the A revision of IPC-7093, Design and Assembly Process Implementation for Bottom Termination SMT Components and is seeing strong interest and support in upgrading the standard. Topics under consideration include consistency of product from multiple suppliers, addressing components 1 mm to 4 mm and inspecting microcracking and poor adhesion.
The 5-22a J-STD-001 Task Group reviewed comments on IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. This task group met a second day to resolve comments on criteria common to both IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability for Electronic Assemblies. The group also celebrated completion of the forthcoming J-STD-001 Revision F Amendment 1.
Page 1 of 2
Suggested Items
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.
Inkjet Solder Mask ‘Has Arrived’
04/10/2024 | Pete Starkey, I-Connect007I was delighted to be invited to attend an interactive webinar entitled “Solder Mask Coating Made Easy with Additive Manufacturing,” hosted by SUSS MicroTec Netherlands in Eindhoven. The webinar was introduced and moderated by André Bodegom, managing director at Adeon Technologies, and the speakers were Mariana Van Dam, senior product manager PCB imaging solutions at AGFA in Belgium; Ashley Steers, sales manager at Electra Polymers in the UK; and Dr. Luca Gautero, product manager at SUSS MicroTec Netherlands.