-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Fore! Sign up for the SMTA International Golf Tournament
August 12, 2016 | SMTAEstimated reading time: Less than a minute
The 9th Annual SMTAI Golf Tournament takes place on Thursday, September 29, 2016, and the Maple Meadows Golf Club. This championship course features a modern combination of links and a prairie design. It’s conveniently located just 10 miles from the Convention Center. Wrap up the week with a day on the links.
COST:
$80 per player, $320 per foursome team
Price Includes:
- · Round of Golf (18 Holes)
- · Golf Cart per 2 Golfers
- · Drink Tickets
- · Hot Buffet Lunch
- · Chance to win performance prizes (i.e., longest drive, closest to pin, 1st-3rd place foursomes)
8:30 am Shotgun Start
50+ Players
Best Ball Scramble
Prizes for Performance
Hot Buffet Lunch
Networking!
To register, click here.
Suggested Items
Intel Announces New Program for AI PC Software Developers and Hardware Vendors
03/27/2024 | Intel CorporationIntel Corporation announced the creation of two new artificial intelligence (AI) initiatives as part of the AI PC Acceleration Program: the AI PC Developer Program and the addition of independent hardware vendors to the program.
SEMI 3D & Systems Summit To Spotlight Trends In Hybrid Bonding, Chiplet Design And Environmental Sustainability
03/26/2024 | SEMILeading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, 12-14 June, 2024,
Ventec to Launch New Bondply Dielectrics and Value-Added Services at IPC APEX EXPO 2024
03/26/2024 | Ventec International GroupVentec International Group is to reveal new products for advanced signal integrity and thermal performance, and introduce services, during IPC APEX EXPO 2024, April 9-11 on booth # 4309.
RTX's Raytheon Lower Tier Air, Missile Defense Sensor Detects and Engages Complex Target
03/25/2024 | RTXRaytheon, an RTX business, announced that its Lower Tier Air and Missile Defense Sensor, or LTAMDS, continues to advance through its U.S. Army test program with another successful live-fire event. Military leaders from seven nations were on-site to witness the radar's capabilities and performance first-hand.
IMAPS Wrap-up: AI, Chiplets, and 3D Cube Architecture
03/22/2024 | Marcy LaRont, PCB007 MagazineThe International Microelectronics Assembly and Packaging Society, IMAPS, held its 20th Device Packaging Expo and Conference this past week in Fountain Hills, Arizona, followed immediately by a ‘Workshop on Advanced Packaging for Medical Electronics’ that continued through the remainder of Thursday. Fortunate to find myself in Texas earlier in the week, I made it for the last day of the IMAPS event and attended two excellent keynote presentations by AMD and Intel, respectively. Here are some highlights.