OUR COLUMNISTS


Barry Olney

Barry Olney, In-Circuit Design Pty. Ltd.

Barry focuses on advanced PCB design, signal integrity, and EMC design techniques.

Latest Column: Beyond Design: Fringing Fields


Team Sunstone Circuits

Team Sunstone Circuits, Sunstone Circuits

Team Sunstone Circuits will cover solutions to help your PCB projects succeed.

Latest Column: Connect the Dots: Unraveling the Mysterious BGA Routing Mess


John Talbot

John Talbot, Tramonto Circuits

John focuses on flex and rigid-flex PCB and PCBA technologies, as well as various global business, technical, and market aspects.

Latest Column: Consider This: Let’s Talk About the Basics of Flex


Dana Korf

Dana Korf, Korf Consultancy LLC

Dana's columns focus on IPC-2581 as well as PCB front-end tooling, data quality, DFM processes, etc.

Latest Column: Dana on Data: A Team Method to Reduce Fabricator Engineering Questions


Patrick Crawford

Patrick Crawford, IPC

Patrick Crawford provides updates on IPC Design activities.

Latest Column: Design Circuit: IPC-2231 Captures Board Design Best Practices


Vern Solberg

Vern Solberg, Consulting

This column will focus on technical issues related to PCB and Flex circuit design, etc.

 

Latest Column: Designers Notebook: Panel-level Semiconductor Package Design Challenges


John Watson

John Watson, Altium

John Watson covers a variety of tips that designers need to know.

Latest Column: Elementary, Mr. Watson: Location, Location, Location


Dugan Karnazes

Dugan Karnazes, Velocity Research

Dugan Karnazes is the founder and CEO of Velocity Research in Grand Rapids, Michigan.

Latest Column: Figure It Out: Effective Collaboration Tools for Post-COVID-19 Engineering


Joe Fjelstad

Joe Fjelstad, Verdant Electronics

As author of the Flexible Circuit Technology books, Joe covers everything to do with flexible interconnections in this column.

Latest Column: Flexible Thinking: Thermal Management—Electronic Technology’s Rodney Dangerfield


IPC Education Foundation

IPC Education Foundation, IPC

Members from the IPC Education Foundation share updates on programs and activities.

Latest Column: Foundations of the Future: The Semi-Virtual Landscape of College for IPC Student Chapter Members


NCAB Team

NCAB Team, NCAB Group

Field application engineers from NCAB Group's technical team explore fresh PCB concepts.

Latest Column: Fresh PCB Concepts: 4 Characteristics to Consider When Selecting PCB Base Materials


Dan Beaulieu

Dan Beaulieu, DB Management

This weekly column is focused on helping electronics companies enhance their professional and technical image through sales and marketing, and, of course, common sense.

Latest Column: It’s Only Common Sense: Tom Brady’s Leadership Tips


John Coonrod

John Coonrod, Rogers Corporation

John Coonrod offers PCB designers advice on modern laminates, with a focus on high-speed substrates.

Latest Column: Lightning Speed Laminates: Why High-Frequency Materials Have Different Dk Values


John Mitchell

John Mitchell, IPC--Association Connecting Electronics Industries

John will cover issues affecting the entire global electronics industry supply chain.

Latest Column: One World, One Industry: Navigating Around the Future


Duane Benson

Duane Benson, Screaming Circuits

Duane offers tips and tricks for PCB assembly issues.

Latest Column: Powerful Prototypes: A Trip Back to the Basics


Istvan Novak

Istvan Novak, Samtec

Focusing on signal and power integrity issues related to PCB design and design engineering.

Latest Column: Quiet Power: Be Aware of Default Values in Circuit Simulators


Team Electrolube

Team Electrolube, Electrolube

Team Electrolube illustrates the best PCB design practices for optimizing the conformal coating process.

Latest Column: Sensible Design: Pushing the Boundaries of Thermal Management


Team ASC

Team ASC, American Standard Circuits

The experts behind this column strive to make all facets of printed circuit board technology clear and easy to understand.

Latest Column: Standard of Excellence: 4 Areas That Will Improve by Next Year


Mark Thompson

Mark Thompson, Monsoon Solutions Inc.

Mark Thompson discusses PCB design from a fabricator's viewpoint, with a focus on DFM issues.

Latest Column: The Bare (Board) Truth: 5 Questions About Improving Thermal Management


Kelly Dack

Kelly Dack, Printed Circuit Engineering Association

This column is dedicated to providing news about PCB design classes and events, as well as helping engineers, designers, and anyone related to printed circuit design from around the globe to network and share information.

Latest Column: The Digital Layout: Local Chapters—You Can Distance This Body But Not These Senses


Chris Mitchell

Chris Mitchell, IPC

In this column, IPC VP of Global Government Affairs Chris Mitchell and his team provide news and views on government policies that affect the electronics industry and its supply chain.

Latest Column: The Government Circuit: U.S. and European Lawmakers Eyeing Changes That Would Affect Our Industry


Team Elmatica

Team Elmatica, Elmatica

The PCB Norsemen from Elmatica share their knowledge, experience, technical advice, and thoughts about the fascinating world of PCBs.

Latest Column: The PCB Norsemen: A Path to Successful PCB Fabrication


Martyn Gaudion

Martyn Gaudion, Polar Instruments

In his column, Martyn discusses signal integrity and impedance design test.

Latest Column: The Pulse: Application Notes—Advice for Authors


Tim Haag

Tim Haag, First Page Sage

Tim Haag discusses PCB design topics from his viewpoint as an EDA technologist and longtime board designer.

Latest Column: Tim’s Takeaways: Thermal Management for PCB Designers—Staying Out of the Fire


Imran Valiani

Imran Valiani, RUSH PCB Inc.

Imran Valiani addresses ways to get products to market as quickly as possible.

Latest Column: Time to Market: 12 Characteristics of NPI Suppliers


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