3D Electronic Devices With Additive Manufacturing
November 29, 2022 | Shavi Spinzi, Nano DimensionEstimated reading time: 1 minute
Imagine fabricating PCBs without the hassle of drilled vias and metal plating. Imagine PCBs with near-perfect registration. If we take it to the next stage, imagine drawing electronics in 3D space.
There is a way to do all this with additively manufactured electronics (AME). We just need to start to think in 3D. This will allow us to abandon the 2D limitations that we have become so used to and expand our horizons so that we can climb to higher levels of performance.
In this article, I will explore the two fundamental capabilities that are the cornerstones for drawing electronics in 3D space, which is where AME technology and 3D design capabilities converge.
The First Cornerstone of AME: Isolation and Conductive Materials
More than a decade ago, we saw the rise of printed electronics (PE), which is printing of conductive traces on a predefined substrate. The substrate is fixed, can be planar or a 3D shape and the printing process—either inkjet, aerosol jetting, or any other method—places the conductor on top of it.
AME differs from PE because it uses more than one material. The simplest configuration for AME consists of two materials: one conductive and one isolation/dielectric. It has the potential to grow to more than two materials by adding combinations of different conductive and isolation materials as well as sacrificial materials to build channels and different complex structures.
Why Do We Need 3D PCB Structures?
The first stage of AME was to imitate traditional PCB 2D structures by building multilayer boards (MLB), plated through-holes (PTH), and microvias to prove that AME can replace "traditional" PCB processes. It certainly is doable, but it does not achieve the full potential and capabilities of 3D AME.
To read this entire article, which appeared in the November 2022 issue of PCB007 Magazine, click here.
Suggested Items
Sypris Reports Q1 2024 Results; Revenue Up 10%
05/15/2024 | Sypris Solutions Inc.The Company’s first quarter 2024 consolidated revenue increased 10.1% to $35.6 million compared with the prior-year quarter, representing the 11th quarter of double-digit year-over-year growth during the past 12 quarterly periods.
SMTC Strengthens Leadership for Future Growth: Ed Smith Promoted to Executive Chairman; Mike Buseman Joins as CEO
05/15/2024 | BUSINESS WIRESMTC Corporation, a leading North American provider of electronics manufacturing services, is pleased to announce the appointment of Mike Buseman as President & Chief Executive Officer, effective May 13, 2024.
Kimball Electronics Thailand Helps Save Lives by Hosting a Blood Drive
05/14/2024 | Kimball ElectronicsKimball Electronics Thailand employees took part in a blood donation event. The blood drive took place in the Rajapruek Building at Laem Chabang Industrial Estate Office.
ACDi Expands East Coast Presence with Acquisition of Fourth Manufacturing Plant
05/13/2024 | ACDiACDi, a leading provider of electronics manufacturing services, today announces the expansion of its East Coast presence and manufacturing capabilities with the acquisition of a fourth manufacturing plant in Kilmarnock, Virginia. The company signed an asset purchase agreement with QinetiQ to acquire their Virginia facility and its assets, including SMT, wave soldering, AOI and SPI equipment. The deal brings ACDi to 4 East Coast locations with a total of 9 SMT lines.
Indium Experts to Present at Electronics in Harsh Environments SMTA Conference
05/13/2024 | Indium Corporationndium Corporation Technical Manager for Europe, Africa, and the Middle East, Karthik Vijay, will deliver a technical presentation and Indium Corporation Senior Technologist, Dr. Ronald Lasky, will deliver both a workshop and technical presentation at the Electronics in Harsh Environments SMTA Conference on May 14-16 in Copenhagen, Denmark.