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iNEMI End-of-Project Webinar: Connector Reliability Test Recommendations
February 23, 2024 | iNEMIEstimated reading time: 1 minute
The iNEMI Connector Reliability Test Recommendations Project, Phases 1 through 3, addressed the need for a standardized reliability evaluation method for connectors. Existing connector reliability testing standards do not address the full range of connector applications nor have the necessary detailed, defined test conditions and sequences required. The project was driven by the need for a more complete understanding of a component’s reliability to determine whether it could potentially have more uses/applications than it was initially designed and tested for, particularly if additional data shows the component can be used in harsher environments.
Phase 1 defined levels of interconnect (connector level) and recommended a physics of failure test approach. In Phase 2 the team defined a set of stress levels and specific test conditions to use when evaluating connector performance.
The Phase 3 team modified the methodology defined in Phase 2 and applied it to two types of connectors: USB-C and SP3 socket. The intention of the modified testing methodology was to perform “tests to failure” to allow reliability estimates to be calculated. This end-of-project webinar will review the development of the test cycles for the connector types addressed, discuss the actual testing and results, plus identify lessons learned and possible next steps.
Registration
This webinar is open to industry; advance registration is required. Two sessions are scheduled (with the same content). If you have any questions or need additional information, please visit iNEMI's website.
Session 1: Asia
Tuesday, February 27
10:00-11:00 a.m. CST (China)
9:00-10:00 p.m. EST (US) on February 26
Session 2: US & Europe
Tuesday, February 27
11:00 a.m. — 12:00 p.m. EST (US)
5:00-6:00 p.m. CET (Europe)
Suggested Items
Hirose Simplifies Assembly with SMT Wire-to-Board Connector
11/30/2023 | HiroseHirose has expanded its low-profile DF51K wire-to-board connector series to include a surface mount technology (SMT) version. Compatible with automated assembly processes, including pick-and-place machines, the DF51K SMT Series simplifies the assembly process and saves significant manufacturing time and cost.
The Shaughnessy Report: Rigid-flex Design No Longer a Niche
09/12/2023 | Andy Shaughnessy -- Column: The Shaughnessy ReportWhen I first started covering this industry in 1999, rigid-flex circuits were considered a niche market. In fact, Compaq was deemed a trendsetter for using rigid-flex in its laptops. Now, analysts at Credence Research predict that the rigid-flex market will top $5 billion by 2026, led in part by the adoption of IoT and the need to connect a variety of smart devices. That’s a pretty big niche. Rigid-flex circuits are everywhere, from servers and smartphones to cameras and pacemakers.
Kyocera Introduces One-Action-Lock FPC/FFC Connectors
07/19/2023 | Business WireKyocera Corporation introduced its 6893 Series connectors for flexible printed circuit board (FPC) and flexible flat cable (FFC), featuring 0.5mm-pitch one-action locking.
iNEMI Call-for-Participation Webinar: PCB Connector Footprint Tolerance Project
05/04/2023 | iNEMISize reduction coupled with increased bandwidth is driving new and tighter PCB/FPC (flexible printed circuit) design requirements that may exceed the capability of fabrication processes used for previous generations of I/O connector interfaces.
Arch Systems Wins 2022 Qlik Global Partner Award
04/19/2023 | Arch SystemsArch Systems, the leading provider of machine data and analytics for electronics assembly operations, announced they have been recognized by Qlik as the OEM Partner of the Year of 2022.