-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Benmayor to Exhibit Technosystem Automation at IPC APEX EXPO 2024
March 25, 2024 | BenmayorEstimated reading time: Less than a minute
Benmayor will exhibit Technosystem Automation at the IPC APEX EXPO 2024, a world-class trade show and cutting-edge technical conference in Anaheim, California, April 6-11, in booth 4432 at Burkle North America (Schmoll).
Technosystem will present highly advanced automation concepts for the PCB industry, featuring Technosystem V3 LDI. This automation is specifically designed for mid-size PCB factories with a high mix and a substantial layer count, where delicate handling is paramount.
The new automation featured at the show will automate the Solder Mask or Dry Film Schmoll MDI Direct Imaginer. The Technosystem V3 LDI can automate all DI or LDI on the market and is equipped with a fully integrated protocol with the ability to manage job queues and make changes without downtime. All Technosystem Automations are prepared for the Industry 4.0.
Visit us at booth 4432 at Burkle North America (Schmoll) to learn more about Technosystem Automation from Benmayor. We look forward to speaking with you.
Suggested Items
Real Time with… IPC APEX EXPO 2024: Digitization and Regular Updates of the iNEMI Industry Roadmap
05/14/2024 | Real Time with...IPC APEX EXPORanjan Chatterjee is a board member at iNEMI. In this conversation with Editor Nolan Johnson, Chatterjee discusses the digitization of, and regular updates to, the industry roadmap. The roadmap is a collaborative effort on technologies and standards which is intended to guide CEOs and CTOs in their long-range planning. Ranjan discusses the board's role in shaping the roadmap and the vision for more frequent updates.
AT&S Adjusts Forecast, Not Considering a Capital Increase, Will Obtain Binding Offers for the Sale of Ansan
05/14/2024 | AT&SAT&S adjusts forecast for the financial year 2026/27, is currently not considering a capital increase, intends to obtain binding offers for the sale of the plant in Ansan, Korea, and proposes not to distribute a dividend for the financial year 2023/24.
KYZEN to Showcase Advanced Packaging Solutions at PCIM Europe 2024
05/14/2024 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is excited to announce its participation in PCIM Europe 2024, scheduled to take place June 11-13, 2024 in Nuremberg, Germany.
epoxySet Launches EC-1015HP - High Temperature, Crack Resistant Epoxy Potting
05/13/2024 | epoxySetepoxySet introduces the EC-1015HP epoxy potting compound. This heat cure system is designed for temperature cycling from -55 to 180°C with significantly better crack resistance than traditional rigid epoxies. As a low viscosity encapsulant, it is used for large and small potting applications with fragile components.
ASMC 2024 Opens With AI, Smart Manufacturing and Sustainability in Focus
05/13/2024 | SEMIThe 35th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2024) opens today to focus on critical topics ranging from yield management and metrology to new developments in artificial intelligence, smart manufacturing and sustainability.