Design Community Town Hall Review
April 11, 2024 | Kelly Dack, CID+, EPTACEstimated reading time: 2 minutes
There’s been a lot of work going on at IPC related to PCB design training and education. This week, many new members of IPC’s design groups met up in person at IPC APEX EXPO.
The Design Community Town Hall took place on the afternoon of April 10, 2024. I was fortunate to attend this event, which marked an opportunity for members of some newly found design groups to get together and exchange ideas. Peter Tranitz, senior director of solutions for IPC, opened the session with a slide presentation introducing these new groups and members within the solutions department.
The Design Leadership Council includes 14 members:
Steve Watt (Zuken), Steven Roy (Optimum Design Associates), Dale Lee (Plexus), Pietro Vergine (Leading Edge), Savita Ganjigatti (Sienna ECAD Technologies), Thomas Romant (IPC Designers Council France), Ellefen Jiang (NCAB), Kevin Kusiak (Lockheed Martin), Susan Kayesar (Siemens), Jesus Castane (MBDA), John Watson (Altium), Igor Bulavitchi (Flex), Flayover Guo, and Huseyin Ariac.
The Global IPC Internal Design Team (GIDT) includes 16 members:
Matt Kelly (Sponsor), Mike Milostan (Marketing), Barry Matties (I-Connect007), Andy Shaughnessy (I-Connect007), Carlos Plaza (Education), Teresa Rowe (Standards), Kelly Scanlon (Sustainability), John Perry (Standards), Peter Tranitz (Initiative Coordinator), Patrick Crawford (Standards), Francisco Fourcade (Standards), Andres Ojalill (Standards), Kris Moyer (Education), Lorena Villanueva (Mexico), Shine Yang (China/Asia), and Saurabh Saxena (India).
These new groups are poised to tackle a variety of challenges as IPC pivots to fill gaps in the design and manufacturing knowledge pool due to the ongoing retirement of our senior subject matter experts.
Tranitz then extended “kudos” to these group members. He emphasized that their “1,000 years of combined knowledge” will come in handy as the groups work and collaborate going forward. He emphasized the need to address critically needed updates in educational training programs as well as design and manufacturing standards and guidelines.
The second half of the meeting included a panel discussion moderated by Susan Kayesar, product manager for PCBflow at Siemens. The panel focused on some soon-to-be published white papers on several key design topics involving CAD data, DFM and stakeholder usage and accessibility. The event wrapped up with a rousing Q&A session. PCB designers and design engineers in the audience were not shy about sharing their opinions.
If you’re a subject matter expert on PCB design, consider getting involved with IPC’s design teams. They will welcome you with open arms, and you’ll probably learn something along the way.
Suggested Items
Real Time with… IPC APEX EXPO 2024: My Role as a Technology Solutions Director
05/02/2024 | Real Time with...IPC APEX EXPOPeter Tranitz, senior director of technology solutions at IPC, shares insights into his role as the design initiative lead. He details his advocacy work, industry support, and the responsibilities of the design initiative committee. The conversation also covers the revamping of standards, the IPC Design Competition, and the implementation of design rules in software tools.
Real Time with… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products
05/01/2024 | Real Time with...IPC APEX EXPOChris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.
IPC's Vision for Empowering PCB Design Engineers
04/30/2024 | Robert Erickson, IPCAs architects of innovation, printed circuit board designers are tasked with translating increasingly complex concepts into tangible designs that power our modern world. IPC provides the necessary community, standards framework, and education to prepare these pioneers as they explore the boundaries of what’s possible, equipping engineers with the knowledge, skills, and resources required to thrive in an increasingly dynamic field.
On the Line With… Talks With Cadence Expert on SI/PI for PCB Designers
05/02/2024 | I-Connect007In “PCB 3.0: A New Design Methodology—SI/PI for PCB Designers,” subject matter expert Brad Griffin, Cadence Design Systems, discusses how an intelligent system design methodology can move some signal and power integrity decision-making into the physical design space, offering real-time feedback.
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.