DYCONEX Successfully Achieves EN 9100:2009 Certification


Reading time ( words)

DYCONEX AG has successfully completed certification according to EN 9100:2009 – the international quality management standard for the aviation and aerospace industry – and has now been added to the OASIS (Online Aerospace Supplier Information System) database.

DYCONEX has been certified to ISO 9001 since 1993, and to ISO 13485 since 2012. The company maintains an extensive quality management system with digitally networked development and manufacturing processes, which guarantee the highest product reliability and 100% traceability. Certification to EN 9100 confirms the effectiveness of the processes and that DYCONEX and its quality system meet the demanding requirements of customers and public authorities in the aviation and aerospace industries.

DYCONEX was audited by Bureau Veritas Certification (Switzerland) AG, an internationally recognized certification institute that has been reviewed and accredited by numerous public authorities.

About DYCONEX AG

With more than 50 years of experience, DYCONEX AG is an international leader in the supply of highly complex flexible, rigid-flex and rigid HDI/microvia circuit boards and chip-substrate solutions. These products are used in every application where miniaturization, increased functionality, quality and the highest level of reliability play a role.

With its headquarters in Bassersdorf, DYCONEX today has 180 employees and the company is a member of the Micro Systems Technologies Group.

About the Micro Systems Technologies Group

The Micro Systems Technologies Group consists of four high-tech companies that offer innovative components and services for medical devices, in particular implants. Other high-tech industries that demand exceptional performance, quality and the highest levels of reliability also rely on the expertise of MST companies.

The globally active companies that make up the MST Group – DYCONEX AG (Switzerland), LITRONIK Batterietechnologie GmbH (Germany), Micro Systems Engineering GmbH (Germany) and Micro Systems Engineering, Inc. (USA) – offer their customers integrated solutions ranging from initial design through to series production.

Share

Print


Suggested Items

PCB Technologies Expands Capabilities

04/16/2021 | Nolan Johnson, I-Connect007
Nolan Johnson speaks with Arik Einhorn and Yaad Eliya of Israel-based PCB Technologies about how they’ve increased their capabilities down to 1 mil line and space to better support their customers from the military, aerospace, and medical markets.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

03/26/2021 | Andy Shaughnessy, Design007 Magazine
This week, we have a round-up of stories from around the industry, including a Real Time with… IPC APEX EXPO interview with Ventec, an article by Tamara Jovanovic about eliminating “garbage in, garbage out,” a review of an EIPC webinar by Pete Starkey, and news about another trade show going virtual this summer. And last but certainly not least, we bring you our one-minute video salute to all the fantastic people in this industry who we’ve worked with for decades. Enjoy!

Bonding Hybrid Multilayer Constructions at Rogers Corporation

03/10/2021 | Real Time with...IPC
John Ekis, Rogers Corporation's market segment director for aerospace and defense, discusses the SpeedWave family of low-dielectric constant, ultra-low-loss prepreg materials with excellent filling and bonding characteristics for hybrid multilayer constructions. SpeedWave prepreg is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing. SpeedWave is available in multiple spread and open weave glass style and resin content combinations, and is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing.



Copyright © 2021 I-Connect007. All rights reserved.