-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
IPC Volunteers Honored for Contributions to Electronics Industry at IPC APEX EXPO
March 1, 2017 | IPCEstimated reading time: 11 minutes
IPC – Association Connecting Electronics Industries presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
For their significant contributions to the 2016-2017 IPC APEX EXPO Technical Program Committee, David Hoover, TTM Technologies, and Jeff Schake, ASM Assembly Systems, earned a Special Recognition Award.
For their leadership of the 2-16 Subcommittee that developed Amendment 1 to IPC-2581B, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology, Gary Carter, Thing Weaver Solutions, LLC and Karen McConnell, Northrop Grumman, earned a Committee Leadership Award. For their contributions to IPC-2581B, Amendment 1, Edward Acheson, Cadence Design Systems; Tomas Bergsten, Ericsson AB; Joseph Clark, DownStream Technologies, LLC; Larry Frost, Sanmina Corporation; Terry Hoffman, Cisco Systems Inc.; Ronny Kovartovsky, Frontline PCB Solutions; Humair Mandavia, Zuken USA Inc.; William Newhard, DownStream Technologies, LLC; James Pierce, Axiom Electronics; Hemant Shah, Cadence Design Systems; Chris Shaw, Fujitsu Network Communications; John Vaughn, Fujitsu Network Communications; Steve Watt, Zuken USA Inc.; and Jamie Wise, WISE Software Solutions Inc., earned a Distinguished Committee Service Award.
For their leadership of the 7-31FT Technical Training Task Group that developed the certification and training program for IPC/WHMA-A-620C, Requirements and Acceptance for Cable and Wire Harness Assemblies, Gregg Owens, Millennium Space Systems and Debbie Wade, Advanced Rework Technology-A.R.T., earned a Committee Leadership Award. For their significant contributions to the certification and training program for IPC/WHMA-A-620C, Floyd Bertagnolli, STM – Service To Mankind and Craig Parker, STM - Service To Mankind, earned a Special Recognition Award. For their contributions to the IPC/WHMA-A-620C certification and training program, Shelley Holt, L-3 Communications; Sean Keating, Amphenol Limited (UK); George Millman, Raytheon Missile Systems; Agnieszka Ozarowski, BAE Systems; Richard Rumas, Honeywell Canada; and Zenaida Valianu, Celestica, earned a Distinguished Committee Service Award.
For their leadership of the 7-34T Technical Training Task Group that developed the certification and training Program for the IPC-7711C/7721C, Rework, Modification, and Repair of Electronic Assemblies, Daniel Foster, Missile Defense Agency and Zenaida Valianu, Celestica, earned a Committee Leadership Award. For their significant contributions to the certification and training program for IPC-7711C/7721C, Dorothy Cornell, Blackfox Training Institute and Jamie Noland, Blackfox Training Institute, earned a Special Recognition Award. For their contributions to the IPC-7711C/7721C certification and training program, Stephen Fribbins, Fribbins Training Services; Garry McGuire, NASA Marshall Space Flight Center; Norman Mier, BEST Inc.; Leo Lambert, EPTAC Corporation; John Vickers, Advanced Rework Technology-A.R.T.; and Debbie Wade, Advanced Rework Technology-A.R.T., earned a Distinguished Committee Service Award.
For their leadership of the 2-18h task group that developed IPC-1755, Conflict Minerals Data Exchange Amendment 2, Eric Straw, Rockwell Collins and Aidan Turnbull, BomCheckNet, earned a Committee Leadership Award. For their contributions to IPC-1755, WAM2, Kazuko Andersen, JEITA; Brenda Baney, B Cubed Consulting, Inc.; David Carnevale, Dolby Laboratories; Forrest Christian, Innovation Machine Ltd.; Bryan Fiereck, Intel Corporation; David Fitton, Diodes Incorporated; Randy Flinders, GreenSoft Technology Inc.; Shiho Ichimura, Panasonic; JEITA, Nikki Johnson, Total Parts Plus; Hiroshi Kobayashi, TDK; Chuck LePard, Hewlett-Packard; N. Nagaraj, Papros, Inc.; Manish Patel, Axon Circuit Inc.; David Pinksy, Raytheon; John Plyler, Blackberry; Michael Wurzman, RSJ Technical Consulting; Akimasa Yamakawa, Murata Manufacturing Co., ltd.; and Tolga Yaprak, iPoint Inc., earned a Distinguished Committee Service Award.
For their leadership of the 7-31f Task Group that developed IPC/WHMA-A-620C, Requirements and Acceptance for Cable and Wire Harness Assemblies, Bud Bowen, Winchester Electronics Division; Brett Miller, USA Harness Inc.; George Millman, Raytheon Missile Systems; and Richard Rumas, Honeywell Canada, earned a Committee Leadership Award. For their significant contributions to IPC/WHMA-A-620C, James Blanche, NASA Marshall Space Flight Center; Robert Cooke, NASA Johnson Space Center; Rick Hawthorne, TE Connectivity; Joseph Kane, BAE Systems Platform Solutions; Garry McGuire, NASA Marshall Space Flight Center; Scott Meyer, UTC Aerospace Systems; Gregg Owens, Millennium Space Systems; Zenaida Valianu, Celestica; Jonathon Vermillion, Ball Aerospace & Technologies Corp.; and Debbie Wade, Advanced Rework Technology-A.R.T., earned a Special Recognition Award. For their contributions to IPC/WHMA-A-620C, Bee Kar Ang, Honeywell Aerospace; Gerald Leslie Bogert, Bechtel Plant Machinery, Inc.; Daniel Foster, Missile Defense Agency; Symon Franklin, Custom Interconnect Ltd; Ben Gross, PRAIRIElectric; Catherine Hanlin, Precision Manufacturing Company, Inc.; Dave Harrell, ViaSat Inc.; Sharissa Johns, Lockheed Martin Missiles & Fire Control; Kathy Johnston, Raytheon Missile Systems; Leo Lambert, EPTAC Corporation; T. John Laser, L-3 Communications; Gary Latta, SAIC; Randy McNutt, Northrop Grumman Aerospace Systems; David Mitchell, Lockheed Martin Mission Systems & Training; Mary Muller, Crane Aerospace & Electronics; Agnieszka Ozarowski, BAE Systems; Robert Potysman, AssembleTronics, LLC; Erik Quam, Schlumberger Well Services; John Tinker, Teledyne Reynolds; and Sharon Ventress, U.S. Army Aviation & Missile Command, earned a Distinguished Committee Service Award.
For her leadership of the IPC E-22 Subcommittee that developed IPC-1071B, Intellectual Property Protection in Printed Board Manufacturing, Pat Stroman, Sparton Corporation, earned a Committee Leadership Award. For their contributions to IPC-1071B, Don Dupriest, Lockheed Martin Missiles & Fire Control; Dennis Fritz, SAIC; Crystal Schneider, Lockheed Martin Missiles & Fire Control; and Richard Snogren, Bristelcone LLC, earned a Distinguished Committee Service Award.
For his leadership of the E-21 Subcommittee that developed IPC-1072, Amendment 1, Intellectual Property Protection in Electronic Assembly Manufacturing, Dennis Fritz, SAIC, earned a Committee Leadership Award. For their contributions to IPC-1072, Amendment 1, Robert Cooke, NASA Johnson Space Center; Mahendra Gandhi, Northrop Grumman Aerospace Systems; Jennie Hwang, H-Technologies Group; Richard Snogren, Bristelcone LLC; Pat Stroman, Sparton Corporation; and Steve Vetter, NSWC Crane, earned a Distinguished Committee Service Award.
Page 1 of 2
Suggested Items
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.
Inkjet Solder Mask ‘Has Arrived’
04/10/2024 | Pete Starkey, I-Connect007I was delighted to be invited to attend an interactive webinar entitled “Solder Mask Coating Made Easy with Additive Manufacturing,” hosted by SUSS MicroTec Netherlands in Eindhoven. The webinar was introduced and moderated by André Bodegom, managing director at Adeon Technologies, and the speakers were Mariana Van Dam, senior product manager PCB imaging solutions at AGFA in Belgium; Ashley Steers, sales manager at Electra Polymers in the UK; and Dr. Luca Gautero, product manager at SUSS MicroTec Netherlands.