-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
SEMI Discusses Benefits of SMT-ELS Protocol
December 13, 2019 | Nolan Johnson, PCB007Estimated reading time: Less than a minute
During productronica 2019, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers.
In this video interview, part of the productronica coverage, the I-Connect007 team speaks with Tom Salmon, VP of collaborative platforms for SEMI
Editor Nolan Johnson and Tom Salmon discuss the SMT- ELS protocol, which is being developed collaboratively as a replacement for SMEMA. Salmon overviews the technology involved and industry acceptance so far. He also explains SEMI’s focus on information and control standards, including the newest solution which allows companies to perform switchovers much faster, thanks to the TCP/IP protocol. This platform also works with traditional PLC systems, shrinking development time from one month to several days.
The productronica event is one of the world’s leading trade fairs for electronics development and production. The productronica trade fair is held on alternating years, at the Messe München in Munich, Germany. The next productronica will be held November 16-19, 2021.
Watch video below:
Suggested Items
GPV''s Function and Site Engagement Meeting in Switzerland
04/23/2024 | GPVThe GPV Executive Leadership Team met with the MDs and local management teams from our German, Swiss and four Nordic Operating Business Units. The meeting was hosted by GPV Electronics CH in Mendrisio, Switzerland.
Altair Acquires Cambridge Semantics, Powering Next-Generation Enterprise Data Fabrics and Generative AI
04/22/2024 | AltairAltair a global leader in computational intelligence, acquired Cambridge Semantics, a modern data fabric provider and creator of one of the industry’s leading analytical graph databases.
Aaron Woolf, Dylan Peterson Join SIA Team
04/22/2024 | SIAThe Semiconductor Industry Association (SIA) announced Aaron Woolf and Dylan Peterson have joined the SIA team. Woolf will serve as director of global policy for economic security and Peterson will be a communications associate. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
Real Time with... IPC APEX EXPO 2024: IPC Government Relations Holds Lawmakers Accountable
04/16/2024 | Real Time with...IPC APEX EXPOThe IPC Government Relations team is constantly educating Congress and the executive branch about the importance of a robust domestic electronics manufacturing industry. As Richard Cappetto explains, the GR team is focused on proactive strategies, workforce policies, and sustainability, as well as the significance of apprenticeship programs, President Biden's executive order, and employer incentives. Also discussed is the PCB Act, its investment program, tax incentive, and DoD's understanding of supply chain risk.
Team Spirit: IPC's Global Advocacy Team Acting on Your Behalf
04/15/2024 | Kate Koger, IPCThe once seemingly apolitical world of printed circuits and soldering irons has evolved into the politically engaged electronics manufacturing industry that we know today. This landscape of technology is quickly evolving by intersecting innovation, economics, and politics.