American Standard Circuits Obtains MIL-PRF-31032 Certification Upgrade


Reading time ( words)

American Standard Circuits has upgraded their qualification to fabricate mil-spec printed circuit boards up to 20 layers out of GF (FR-4). Samples were submitted to the Defense Logistics Agency (DLA) who approved the upgraded MIL-PRF-31032 certification.  

When making the announcement President and CEO Anaya Vardya said, “This is a great accomplishment for our entire team here at American Standard Circuits. With our customer demand and technology steadily increasing we are constantly striving to move forward with all official qualifications. Our goal is always to meet and then exceed our customers’ needs, both today and in the future, and this upgrade represents another vital step in that direction.”

About American Standard Circuits

American Standard Circuits (ASC) prides itself on being a total solutions provider, manufacturing quality rigid, metal-backed, RF/microwave, flex, and rigid-flex PCBs for the medical, automotive, industrial, defense, and aerospace markets in volumes from test and prototypes to large production orders. ASC has the expertise to provide a wide variety of technologies in a time-critical environment. Their qualifications include AS9100 Rev D, ISO 9001:2015, MIL-PRF 31032, MIL-PRF-55110, MIL-PRF-50884 certification and ITAR registration. In addition to manufacturing in the USA, ASC can transition and manage your PCB requirements to lower cost regions via its qualified supply chain of offshore partners. ASC also holds many key patents for metal bonding processes. For more information about American Standard Circuits' services or to ask one of their technology experts a question go to www.asc-i.com.

ASC’s new ebook, Fundamentals of Printed Circuit Board Technologies, is available for download right now on their website, located here, free of charge.

Visit I-007eBooks to download copies of American Standard Circuits’ other micro eBooks:
The Printed Circuit Board Designer’s Guide… to Fundamentals of RF/ Microwave PCBs
The Printed Circuit Designer's Guide to... Flex and Rigid-Flex Fundamentals

Share

Print


Suggested Items

Meet Chris Young, MilAero007 Columnist

04/20/2021 | I-Connect007 Editorial Team
Meet Chris Young, one of our newest I-Connect007 columnists! Chris’ columns will take a lighthearted (sometimes humorous) and informative view of the aerospace and defense industry.

The Heterogeneous Integration Roadmap for Aerospace and Defense

11/24/2020 | Jeff Demmin, Keysight Technologies
Most people in the semiconductor industry are familiar with the International Technology Roadmap for Semiconductors (ITRS), which provided guidance for the industry starting in 1991 (as the National Technology Roadmap for Semiconductors). As the benefits of Moore’s Law became more difficult and more expensive to achieve, the organization decided to publish a final version in 2016. The baton was handed to the Heterogeneous Integration Roadmap (HIR), with the realization that heterogeneous integration—assembling different types of devices rather than monolithic fabrication—is an important enabler for continued progress in the semiconductor industry.

The Aerospace and Defense Chapter of the HIR

11/03/2020 | I-Connect007 Editorial Team
Nolan Johnson and Andy Shaughnessy recently spoke with Jeff Demmin of Keysight Technologies, who breaks down the work his team has done on the Aerospace and Defense Chapter of the Heterogeneous Integration Roadmap (HIR).



Copyright © 2021 I-Connect007. All rights reserved.