N.A. Semiconductor Equipment Industry Posts August 2021 Billings
September 21, 2021 | SEMIEstimated reading time: Less than a minute
North America-based semiconductor equipment manufacturers posted $3.65 billion in billings worldwide in August 2021 (three-month average basis), according to the August Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 5.4% lower than final July 2021 billings of $3.86 billion and 37.6% higher than August 2020 billings of $2.65 billion.
“After an extraordinary eight-month run of record-breaking results, billings of North America-based semiconductor equipment manufacturers expectedly softened in August compared to July,” said Ajit Manocha, SEMI president and CEO. “Nonetheless, billings continue to reflect strong demand for semiconductor equipment and solid year-over-year growth.”
The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.
Suggested Items
Aaron Woolf, Dylan Peterson Join SIA Team
04/22/2024 | SIAThe Semiconductor Industry Association (SIA) announced Aaron Woolf and Dylan Peterson have joined the SIA team. Woolf will serve as director of global policy for economic security and Peterson will be a communications associate. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
Digitalisation and ESG
04/19/2024 | Marina Hornasek-Metzl, AT&SDigitalisation and ESG are prominent and high-priority topics in the global business community. The first focuses on applying technology throughout the value chain to produce faster, smarter, and more desirable business outcomes. The latter emphasises the broader value a business is expected to create for its stakeholders from an environmental, social, and governance perspective.
SEMI Applauds CHIPS Program Office Progress to Diversify U.S. Semiconductor Industry Workforce
04/18/2024 | SEMIThe SEMI Foundation, the arm of SEMI dedicated to supporting economic opportunity for workers and the sustained growth of the microelectronics industry by creating pathways and opportunities for job seekers, applauded strides made by the CHIPS Program Office to diversify the U.S. semiconductor industry workforce and its release of the First Annual Report Regarding the Opportunities and Inclusion Activities Undertaken by the Department of Commerce.
Aspocomp’s Q1 Net Sales and Operating Result Decreased YoY
04/18/2024 | AspocompInflation and interest rates, weak economic development, the uncertainties posed by Russia’s war of aggression and the situation in the Middle East, and global trade policy tensions will affect the operating environment of Aspocomp and its customers in the 2024 fiscal year.
IDTechEx Explores the Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC and AI Products
04/18/2024 | PRNewswireSemiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations