-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
SMTA China Presents Awards at SMTA China South 2015 Conference/NEPCON South China 2015
September 2, 2015 | SMTA ChinaEstimated reading time: 1 minute
SMTA China announces that it presented awards for seven papers at the SMTA China South 2015 Conference Award Presentation Ceremony, held on Tuesday, August 25, 2015 at Shenzhen Convention & Exhibition Center in conjunction with the SMTA China Annual Award Ceremony.
IBM Procurement China Limited’s Ben Wu was awarded The Best Paper of Technology Conference One for the paper titled “The Challenge of Solder Hot Tear and Solutions”
Artesyn Embedded Technologies’ Tory Chen and Enthone Inc.’s Sunny Mu were awarded The Best Paper of Technology Conference Two for the paper titled “Going Live of Organic Metal (ENTEK® OM) As PCB Final Finish - Implementing In PCBA Assembly, ENTEKOM Nano-Organic Metal® PCB Final Finish”
Rae Wong, from Inventec Performance Chemicals(Shanghai) Co., Ltd. received the award for The Best Presentation of Technology Conference One for the presentation titled “Cleaning PCBs In Electronics: Understanding Today’s Needs”
Rick Nichols, from Atotech Deutschland GmbH received the award for The Best Presentation of Technology Conference Two for the presentation titled “Is It Possible To Use Markers To Select The Right Soldermask To Optimize The Yield of Your Final Finish? ”
Jiaqiang Huang, from Shenzhen City TongFang Electronic New-Material, received the award for The Best Presentation of Vendor Conference One for the presentation titled “Influence of Ni Coated Carbon Nanotubes Addition On Microstructures and Properties of Low Silver Content Sn-Ag-Cu Lead-Free Solder Paste”
Yunhong Yu, from Air Liquide (China) Holding Co., Ltd. received the award for The Best Presentation of Vendor Conference Two for the presentation titled “Special N2 Application Solution for Wave Soldering Machine”
Jie Zhu, from ASM Assembly Systems Ltd. received the award for The Best Presentation of Vendor Conference Three for the presentation titled “Smart Factory: First Step On The Path To Industry 4.0”
Metcal, received the award for The Best Emerging Exhibit of the Year 2015 China South with the product of “Metcal Scarab Site Cleaning System”
Vitronics Soltec Pte Ltd. received the award for The Best Exhibit Technology of the Year 2015 China South with the product of “Vitronics Soltec Selective Soldering System”
Suggested Items
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.