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IPC Standards Committee Reports – Packaged Electronic Components, Flex Circuits, High Speed/High Frequency, Rigid Printed Boards
December 7, 2015 | IPCEstimated reading time: 4 minutes
The D-31b IPC-2221/2222 Task Group met to advance the working draft of IPC-2226A, Sectional Design Standard for HDI Printed Boards, which is the first revision effort for this standard since its original 2003 publication. Attendees were segmented into five subgroups to work on content in sections 3 through 6.
The D-33a Rigid Printed Board Performance Task Group and the 7-31a IPC-A-600 Task Group met jointly to review and approve photographs of acceptable and nonconforming anomalies for the future “J” revision to IPC-A-600, Acceptability of Printed Boards. The photographs presented were intended to address new and expanded requirements released in the new IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards.
The D-35 Printed Board Storage and Handling Subcommittee met to complete the review of industry feedback to the working draft of an “A” revision to the IPC-1601, Printed Board Handling and Storage Guidelines. The group addressed comments related to measurement of moisture content, the use of oxidation arrest paper, the impact of baking on ENEPIG and ENIG surface finishes, and recommendations for resealing opened moisture barrier bags for storage of bare printed boards. A Final Draft for Industry Review will be circulated in Q4 2015.
Page 3 of 3Suggested Items
Airbus Achieves Eurodrone’s Preliminary Design Review
05/16/2024 | AirbusThe Eurodrone programme has successfully performed the Preliminary Design Review (PDR). Led by Airbus Defence and Space as prime contractor, this major programme milestone has been completed with OCCAR and representatives of the four customer nations (France, Germany, Italy and Spain) in the presence of the three Major Sub-Contractors (MSC), Airbus Defence and Space Spain, Dassault Aviation and Leonardo.
A Review of the 2024 Del Mar Electronics and Manufacturing Show
05/16/2024 | Barry Matties, I-Connect007The Del Mar Electronics and Manufacturing Show (DMEMS) in Del Mar, California, recently took place at an unlikely venue: the Del Mar Fairgrounds. Doug Bodenstab, founder and show organizer, says the show covers everything in electronics manufacturing: design tools, components, base materials, training, testing, board fabrication, AI, data analytics, and more. While you can find about anything online these days, Bodenstab adds that there is no substitute for meeting people in person.
TactoTek Licenses IMSE Technology to Polestar for Sustainable Electronics Design Innovation
05/15/2024 | TactoTekPolestar, the Swedish electric performance car brand, and Finnish smart surface pioneer TactoTek, have entered a collaboration to explore integration of Injection Molded Structural Electronics (IMSE) technology into Polestar’s vehicle programs.
The Shaughnessy Report: Unlock Your High-speed Material Constraints
05/15/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportThe world of PCB materials used to be a fairly simple one. It was divided into two groups: the “traditional” laminates, often called FR-4, and the high-speed laminates developed especially for high-speed PCBs. These were two worlds that usually didn’t collide. But then traditional laminates started getting better, and high-speed designers and design engineers took notice and started to reconsider what FR-4 could be used for.
Standard of Excellence: Collaboration—The Right Path to Innovation
05/15/2024 | Anaya Vardya -- Column: Standard of ExcellenceNow more than ever, as new and innovative technologies for printed circuit boards are in demand, we need collaboration between PCB designers, fabricators, and assemblers. Close partnerships with PCB designers and assemblers are key to developing and producing PCBs with boards with new and innovative technology. These collaborative partnerships, along with the partnership with the end customers, are more critical than ever before.